Qualcomm is rumored to be developing the Snapdragon 8 Elite 2 chipset, which could deliver a substantial 20 percent increase in performance despite adjustments in its development strategy. According to sources, the new chipset will be manufactured exclusively using TSMC’s advanced N3P process. This comes after the recent launch of the Snapdragon 8 Elite at Qualcomm’s annual Snapdragon Summit in Hawaii, which already showcased notable improvements with its on-device generative AI and second-generation custom-built Qualcomm Oryon CPU cores.
Tipster @Jukanlosreve shared on X (formerly known as Twitter) that the Snapdragon 8 Elite 2 could achieve a single-core benchmark score around 4,000 points on Geekbench 6, a significant leap from the Snapdragon 8 Elite’s reported 3,200 points. This improvement follows Qualcomm’s delivery of a 30 percent increase in CPU performance with the Snapdragon 8 Elite compared to the previous Snapdragon 8 Gen 3 chip.
In addition, MediaTek’s upcoming Dimensity 9500 chipset is also expected to match this performance level. Initially, there were plans for the Snapdragon 8 Elite 2 to utilize Samsung Foundry’s SF2 2nm-class manufacturing along with TSMC’s N3P process, but these plans have since been canceled, leaving TSMC as the sole manufacturer.
The Snapdragon 8 Elite chip, based on a 3nm fabrication process, features the second-generation custom-built Qualcomm Oryon CPU with eight cores and a peak clock speed of 4.32GHz. It includes the Qualcomm Adreno GPU and an enhanced Hexagon NPU, contributing to a 40 percent boost in gaming performance and a 35 percent improvement in ray-tracing capability compared to the Snapdragon 8 Gen 3.
