At Mobile World Congress 2026, MediaTek is preparing to spotlight its next wave of artificial intelligence and wireless connectivity technologies under the theme “AI For Life From Edge to Cloud.” The company confirmed that its keynote session led by President Joe Chen will take place on March 4 in Hall 8, where partners and industry leaders will join in presenting innovations spanning 6G research 5G Advanced customer premises equipment automotive solutions flagship mobile AI and data centre infrastructure.
A major highlight of the showcase will be what MediaTek describes as the world’s first live 6G radio interoperability demonstration. The company says the technology aims to balance speed latency and power efficiency while supporting generative and agentic AI workloads. The demonstration will also underline the potential of 6G combined with edge computing to power advanced robotics and other compute intensive real time applications.
MediaTek is also expected to introduce its “personal device cloud” framework designed to allow AI agents across smartphones home devices and family systems to collaborate securely using Wi Fi and future 6G networks. In addition the company plans to present AI accelerated uplink transmit diversity technology for 6G which dynamically optimises signal performance beyond traditional rule based mechanisms.
Another headline announcement will be a 5G Advanced CPE device with integrated Wi Fi 8 support powered by the MediaTek T930 and Filogic 8000 chipsets. Built to comply with 3GPP Release 18 standards the equipment features eight receive antennas and three transmit antennas supporting five MIMO layers. MediaTek claims this design can significantly enhance spectrum efficiency and improve uplink speeds.
For automotive applications the company will demonstrate what it calls the first 5G NR NTN based video call alongside a new telematics chipset compatible with 5G Advanced Release 17 and Release 18 standards. The chipset integrates modem level AI to enhance network reliability and stability in connected vehicles.
MediaTek will further introduce a new Dimensity Auto smart cockpit platform manufactured on a 3nm automotive grade process. The system integrates Arm v9.2 CPU cores advanced graphics with ray tracing capabilities and a dedicated NPU to power generative AI voice assistants while preserving user data privacy.
In wearable technology the brand plans to reveal AI powered smart glasses driven by the Dimensity 9500 enabling on device multimodal AI interactions across text images voice and video.
Beyond consumer and automotive segments MediaTek will showcase its UCIe Advanced IP solution for data centres validated on advanced semiconductor nodes. The company also intends to present its co packaged optics platform designed to deliver high speed fibre connectivity with improved efficiency for cloud infrastructure.
Through these announcements MediaTek aims to reinforce its strategy of accelerating AI adoption across smartphones IoT ecosystems vehicles and next generation cloud systems at MWC 2026.