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MediaTek Unveils Dimensity 9400 Plus Chipset With Enhanced AI Power and Extended Bluetooth Range for Flagship Android Phones

MediaTek Dimensity 9400 Plus MediaTek latest chipset MediaTek 5G processor Dimensity 9400+ specs AI smartphone chip Android flagship processor Bluetooth 10km range MediaTek new launch Oppo Find X8s Vivo X200s Realme GT7 MediaTek NPU 890 Speculative Decoding Plus SpD+ Arm Cortex X925 LPDDR5x UFS 4.0 support 320MP camera smartphone GPU MediaTek Immortalis G925 AI imaging tools Imagiq 1090 Bluetooth 6.0 Wi-Fi 7 Sub-6 5G support 4G LTE NavIC GPS BeiDou Glonass Galileo QZSS Androi

MediaTek has officially introduced its most advanced chipset to date — the Dimensity 9400 Plus. Designed to power high-end Android smartphones, this latest offering brings improved CPU and NPU performance, along with groundbreaking features like extended-range Bluetooth connectivity. With an all-big-core architecture, the Dimensity 9400+ stands as MediaTek’s most capable processor yet.

The Dimensity 9400 Plus builds on its predecessor, the Dimensity 9400, offering a slight clock speed increase. The chipset features a primary Arm Cortex-X925 core running at 3.73GHz, three Cortex-X4 cores, and four Cortex-A720 cores — maintaining the powerful All Big Core design for peak performance. MediaTek continues with support for LPDDR5x memory, UFS 4.0 storage, and camera capabilities of up to 320 megapixels.

What sets the Dimensity 9400+ apart is its AI performance. It comes equipped with the MediaTek NPU 890, which now supports Speculative Decoding Plus (SpD+), offering up to 20 percent faster agentic AI processing. This will significantly enhance tasks involving real-time language translation, image generation, and AI-driven photography.

In terms of graphics, the Dimensity 9400+ retains the 12-core Arm Immortalis-G925 MC12 GPU. The image processing unit (ISP), called MediaTek Imagiq 1090, offers the same powerful imaging capabilities found in the standard 9400 chip, ensuring support for high-resolution photography and videography.

The new chipset also brings a major leap in connectivity. It now supports Bluetooth connections between phones at distances up to 10 kilometers, far exceeding the 1.5 km range supported by the standard Dimensity 9400 chip. Other connectivity features include support for 5G (Sub-6), 4G LTE, Wi-Fi 7, Bluetooth 6.0, and various global navigation satellite systems like GPS BeiDou Glonass Galileo QZSS and NavIC.

Smartphones powered by the Dimensity 9400 Plus will begin arriving this month, starting with the Oppo Find X8s and Find X8s Plus in China. These devices are expected to hit global markets soon. Following them, other premium handsets like the Vivo X200s and Realme GT7 will also feature this high-performance SoC, offering users top-tier speed and AI capability.

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