New leaks have surfaced detailing the next-generation flagship chipset from Qualcomm, offering an early look at what to expect from the Snapdragon 8 Elite Gen 6 and how it compares to its higher-end Pro counterpart. The company is reportedly planning a dual-chip strategy, targeting different segments of the premium smartphone market.
According to industry sources, the standard Snapdragon 8 Elite Gen 6, believed to carry the model number SM8950, could be built using an advanced 2nm manufacturing process from TSMC. If accurate, this would mark a significant technological step forward, improving efficiency and performance over current chipsets like the Snapdragon 8 Elite Gen 5.
The leaked configuration suggests a 2+3+3 Oryon CPU architecture, supported by a shared 16MB L2 cache. On the graphics front, the chipset may include an Adreno 845 GPU with a six-slice design, along with 12MB of GMEM and an additional 6MB system-level cache. This setup is expected to deliver strong performance for high-end smartphones without pushing costs into ultra-premium territory.
In terms of memory and storage, the standard variant is likely to support LPDDR5x RAM and UFS 5.0 storage, making it suitable for flagship and upper mid-range devices. It is expected to sit below the more powerful Snapdragon 8 Elite Gen 6 Pro in overall capability.
The Pro variant, reportedly carrying the model number SM8975, is expected to push performance even further. Early rumours indicate it could feature a more advanced Adreno 850 GPU, increased graphics memory, and support for next-generation LPDDR6 RAM. This would position it for use in ultra-premium smartphones with top-tier performance demands.
Overall, both chipsets are expected to bring noticeable improvements in graphics processing, efficiency, and overall speed compared to the current generation. However, the Pro version is likely to come with higher production costs, limiting it to select flagship devices.