The next-generation HMD Fusion 2 is set to raise the bar for modular smartphones with several exciting upgrades. According to leaks, the device will be powered by the Qualcomm Snapdragon 6s Gen 4 processor and feature Smart Outfits Gen 2 with a new Pogo Pin 2.0 system, allowing users to attach a variety of customizable modules.
The HMD Fusion 2 will reportedly include a 6.58-inch Full HD+ OLED display with a 120Hz refresh rate, offering smooth visuals and immersive viewing. The modular Smart Outfits are expected to include options such as a Casual Outfit with Kickstand, Wireless Charging Outfit, Rugged Outfit, Gaming Outfit, Camera Grip Outfit, Speaker Outfit, Flashy Outfit, QR and Barcode Outfit, and a Smart Projector Outfit. These new accessories will not be compatible with the first-generation HMD Fusion.
On the photography front, the device is said to feature a dual-camera setup on the back, including a 108-megapixel primary sensor with OIS and an 8-megapixel ultra-wide lens. Additional features include IP65 water and dust resistance, Bluetooth 5.3, dual speakers, and a 3.5mm audio jack. While the launch date remains unconfirmed, the leaks suggest that HMD is gearing up to make a major impact with its modular smartphone lineup.
