MediaTek is reportedly working on its next mid-range processor called the Dimensity 8500 which is expected to succeed the Dimensity 8400. According to early industry leaks the upcoming SoC is currently undergoing internal testing and could feature inside new smartphones from Honor and Xiaomi including a device equipped with a massive 10000mAh battery. This chipset aims to offer upgrades in speed efficiency and graphics capability compared to the current generation powering models like the Vivo Y300 GT.
As per leaked details from a reliable tipster the Dimensity 8500 may be manufactured using TSMC’s advanced 4nm fabrication process. The processor could come with an octa core CPU setup featuring Cortex A725 performance cores capable of achieving peak speeds of up to 3.4GHz during prototype testing. This suggests a notable jump in performance for upcoming mid-range phones.
Graphics performance is also expected to see a boost thanks to a refined Mali G720 GPU reportedly clocked at 1.5GHz. Benchmark leaks indicate that the chipset crossed more than 2.2 million points on AnTuTu hinting at impressive gaming results. Some reports claim that its GPU could even outperform Qualcomm’s Snapdragon 8 Gen 3 and Snapdragon 8s Gen 4 in certain tests making it a strong competitor in the mid-premium category.
Rumours suggest that devices like the upcoming Xiaomi 17T series and a new Honor Power series phone could utilise the Dimensity 8500 chipset. Both smartphones are expected sometime in early 2026. While details appear promising MediaTek has yet to officially reveal the launch timeline for its next Dimensity 8000 series chipset.
MediaTek recently showcased its flagship Dimensity 9500 based on a 3nm process supporting higher peak clock speeds UFS 4.1 storage and powering flagship lineups like Vivo X300 and Oppo X9. With the Dimensity 8500 the company appears ready to strengthen its position in the competitive mid-range chipset market.
